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Distinguished Committee Service Award for Daniel Brandler

Daniel Brandler, Technical Director of Ohmega Technologies, Inc., will be receiving a Distinguished Committee Service Award in appreciation for his contributions in the development of IPC-4811, Specification for Embedded Passive Resistor Materials for Rigid and Multilayer Printed Board. The award will be presented at the IPC awards luncheon on 9/23/2008 at the Renaissance Schaumberg Hotel & Convention Center in Schaumberg, Illinois.

Ohmega Technologies, Inc. exhibition at IPC APEX Expo March 31 -- April 2, 2009.

OHMEGA-PLY® BURIED RESISTOR IN HIGH-DENSITY
INTER-CONNECT (HDI) BGA PACKAGE

OHMEGA-PLY® SERIES TERMINATION BURIED RESISTOR UNDER BGA PACKAGE

ENLARGEMENT OF OHMEGA-PLY® SERIES TERMINATION BURIED RESISTOR UNDER BGA PACKAGE

OHMEGA-PLY® PARALLEL TERMINATION BURIED RESISTOR UNDER BGA PACKAGE

ENLARGEMENT OF OHMEGA-PLY® PARALLEL TERMINATION BURIED RESISTOR UNDER BGA PACKAGE