Ohmega

Ohmega Technologies, Inc. showcases OhmegaPly RF at the IEEE-IMS show June 2-6 (visit Ohmega Technologies, Inc. at booth 2804)

Dong — Sat, 01 Jun 2013 01:32:59 +0000

OhmegaPly® NiP thin-film resistive material is extensively used in microwave and RF circuit applications. Its integration into microwave circuits has substantial benefits including greater packaging densities, more functionality such as signal division and/or distribution, reduced signal adaptation issues, elimination of … Continue reading →

Ohmega Technologies, Inc. will be exhibiting at the upcoming trade shows:

Dong — Wed, 27 Feb 2013 19:15:21 +0000

ESTC – Electronics System Tech., Tropicana Las Vegas, NV May 20-23, 2013

IEEE – International Microwave Symposium, Seattle, WA June 2-7, 2013

PCB – West, Santa Clara Convention Center, Santa Clara, CA September 24-26, 2013

Design – East, Boston Convention & Exhibition Center, Boston, MA September 30 – October 2

DesignCon, Santa Clara Convention Center, Santa Clara, CA January 28-31, 2014

IPC/APEX, Mandalay Bay, Las Vegas, NV March 25-27, 2014

New Paper: “Micro Trace Resistive Technology”, by Bruce Mahler presented at technical conference – IPC Apex Expo 2013

Dong — Wed, 27 Feb 2013 01:03:17 +0000

Micro Trace Resistor Technology allows thin film resistors to be built within a printed circuit trace that is less than 100 microns wide. Using standard subtractive printed circuit board processes, it is ideal for high density interconnect (HDI) designs where passive component placement is difficult or impossible. By utilizing the differential processes unique to the OhmegaPly® nickel phosphorous (NiP) resistive material, copper traces can be imaged and etched to define resistor widths that are precise and sharply defined, resulting in the creation of miniature resistors with consistent ohmic values. With low inductance and good tolerances, Micro Trace Resistors are ideal for line termination and pull-up/down applications.

To request a digital copy, please email Bruce Mahler: bmahler@ohmega.com

Bruce Mahler is interviewed at DesignCon 2013

Dong — Mon, 04 Feb 2013 20:26:26 +0000

Bruce Mahler describes the Ohmegaply MTR™ (Micro Trace Resistor) solution for embedded resistance. If the video interview doesn’t play, please go to: http://realtimewith.net/pages/rtwvprofile.cgi?rtwvcatid=10&rtwvid=2692

Ohmega Technologies introduces OhmegaPly® MTR™ — the next generation of OhmegaPly thin film resistor material.

Dong — Fri, 18 Jan 2013 19:11:34 +0000

Culver City, CA: (January 11^th, 2013) – Ohmega Technologies has introduced OhmegaPly^® MTR™ Technology, which allows thin film resistors to be built within a printed circuit trace that is less than 100 microns (0.004”) wide. Using standard subtractive printed circuit board processes, it is ideal for high density interconnect (HDI) designs where passive component placement is difficult or impossible.

Ohmega Technologies, Inc. will be exhibiting at the upcoming DesignCon2013 in Santa Clara, CA January 29-30, 2013 and the upcoming IPC/APEX 2013 in San Diego, CA February 19-21, 2013 where the OhmegaPly^® MTR™ product will be showcased.

New Product Announcement: Ohmega Technologies, Inc. announced at the IPC HDI Conference held in Los Angeles October 24-25, 2012 the introduction of OhmegaPly MTR (Micro Trace Resistors).

Dong — Fri, 26 Oct 2012 17:17:08 +0000

OhmegaPly^® MTR^TM technology allows thin film resistors to be built within a printed circuit trace less than 100 microns (0.004″) wide.

OhmegaPly is used successfully in U.S Air Force Commercially Hosted Infrared Payload (CHIRP) sensor

Dong — Fri, 10 Aug 2012 18:43:12 +0000

The article was posted on Space News magazine

http://www.spacenews.com/military/120413-hosted-success-af-plans-follow-on.html

Pictures from DesignCon 2012

Dong — Mon, 06 Feb 2012 23:28:32 +0000

New Paper: “The Performance of Embedded Resistors by Alloy Type and Film Thickness”, by Daniel Brandler

Dong — Tue, 08 Nov 2011 23:27:21 +0000

Daniel Brandler authors a paper entitled “The Performance of Embedded Resistors by Alloy Type and Film Thickness” appearing in the PCB Magazine (November 2011 issue). To read the article please go to: http://www.iconnect007.com/emag/pub/PCB-Nov2011/

New Release:

Dong — Fri, 10 Jun 2011 20:50:50 +0000

Ohmega Technologies, Inc. and Spectra Innovations, Inc. signed an agreement for the distribution and support by Spectra Innovations of Ohmega Technologies’ OhmegaPly^®Thin Film Embedded Resistive Material in India.