When you work with the world’s most dynamic technology companies, there’s always something newsworthy.
New Paper: “The Performance of Embedded Resistors by Alloy Type and Film Thickness”, by Daniel Brandler
Daniel Brandler authors a paper entitled “The Performance of Embedded Resistors by Alloy Type and Film Thickness” appearing in the PCB Magazine (November 2011 issue). To read the article please go to: http://www.iconnect007.com/emag/pub/PCB-Nov2011/
New Release:
Ohmega Technologies, Inc. and Spectra Innovations, Inc. signed an agreement for the distribution and support by Spectra Innovations of Ohmega Technologies’ OhmegaPly® Thin Film Embedded Resistive Material in India.
New Study: “Realizing Thin Electromagnetic Absorbers for Wide Incidence Angles from Commercially Available Planar Circuit Materials”
The studies in this paper show that OhmegaPly could be used as thin electromagnetic absorbers and it was presented at the 3rd International Congress on Advanced Electromagnetic Materials in Microwaves and Optics, London, UK, Aug 30th-Sept 4th, 2009.
Dan Brandler is Interviewed at IPC
Dan Brandler addresses concerns over reliability of embedded passives as well as testing procedures from new types of lead-free solder. If the video interview doesn’t start automatically, please go to: http://www.realtimewith.com/pages/rtwvprofile.cgi?rtwvcatid=10&rtwvid=1881
Ohmega Technologies, Inc. exhibited at IPC/Apex Show, Las Vegas April 11 – 15, 2011
Ohmega Technologies presented the latest information and updates on OhmegaPly®, their premier embedded resistor material. The IPC/Apex show was held at the Mandalay Bay Hotel and Resort in Las Vegas from April 11-15.
Paper: Dan Brandler presented at BiTS
Dan Brandler presented a paper at the BiTS Conference entitled “Embedded Thin Film NiP Resistors in Burn-In Trays”. Dan was among the authors presenting the latest technology on burn-in board and test equipment topics. For a copy of the presentation please download below.
BiTS was held at Hilton Phoenix East/ Mesa, AZ, March 6-9, 2011.
Paper: “The Design and Use of NiP Embedded Thin-Film Resistive Materials for Series and Parallel Termination”, by Bruce Mahler
Bruce Mahler authors a paper entitled “The Design and Use of NiP Embedded Thin-Film Resistive Materials for Series and Parallel Termination” appearing in Circuitree Magazine’s Winter Edition (February 1, 2011).
To read the article please go to:
http://www.circuitree.com/Articles/Feature_Article/BNP_GUID_9-5-2006_A_10000000000000992274
Dan Brander, Ohmega Technologies Technical Director presents paper at EIPC Winter Conference in Cologne, Germany
Dan Brandler presented a paper on February 4, 2011 entitled “Electrical Performance of Embedded Resistors in PCB’s for Lead-Free Assembly”. Please click here for a copy of the presentation and paper
