When you work with the world’s most dynamic technology companies, there’s always something newsworthy.
ESTC – Electronics System Tech., Tropicana Las Vegas, NV May 20-23, 2013
IEEE – International Microwave Symposium, Seattle, WA June 2-7, 2013
PCB – West, Santa Clara Convention Center, Santa Clara, CA September 24-26, 2013
Design – East, Boston Convention & Exhibition Center, Boston, MA September 30 – October 2
DesignCon, Santa Clara Convention Center, Santa Clara, CA January 28-31, 2014
IPC/APEX, Mandalay Bay, Las Vegas, NV March 25-27, 2014
Micro Trace Resistor Technology allows thin film resistors to be built within a printed circuit trace that is less than 100 microns wide. Using standard subtractive printed circuit board processes, it is ideal for high density interconnect (HDI) designs where passive component placement is difficult or impossible. By utilizing the differential processes unique to the OhmegaPly® nickel phosphorous (NiP) resistive material, copper traces can be imaged and etched to define resistor widths that are precise and sharply defined, resulting in the creation of miniature resistors with consistent ohmic values. With low inductance and good tolerances, Micro Trace Resistors are ideal for line termination and pull-up/down applications.
To request a digital copy, please email Bruce Mahler: email@example.com
Bruce Mahler describes the Ohmegaply MTR™ (Micro Trace Resistor) solution for embedded resistance. If the video interview doesn’t play, please go to: http://realtimewith.net/pages/rtwvprofile.cgi?rtwvcatid=10&rtwvid=2692
Culver City, CA: (January 11th, 2013) – Ohmega Technologies has introduced OhmegaPly® MTR™ Technology, which allows thin film resistors to be built within a printed circuit trace that is less than 100 microns (0.004”) wide. Using standard subtractive printed circuit board processes, it is ideal for high density interconnect (HDI) designs where passive component placement is difficult or impossible.
Ohmega Technologies, Inc. will be exhibiting at the upcoming DesignCon2013 in Santa Clara, CA January 29-30, 2013 and the upcoming IPC/APEX 2013 in San Diego, CA February 19-21, 2013 where the OhmegaPly® MTR™ product will be showcased.
Daniel Brandler authors a paper entitled “The Performance of Embedded Resistors by Alloy Type and Film Thickness” appearing in the PCB Magazine (November 2011 issue). To read the article please go to: http://www.iconnect007.com/emag/pub/PCB-Nov2011/
Ohmega Technologies, Inc. and Spectra Innovations, Inc. signed an agreement for the distribution and support by Spectra Innovations of Ohmega Technologies’ OhmegaPly® Thin Film Embedded Resistive Material in India.