Ohmega’s Embedded Resistor technology is tried, tested and trusted. For over 35 years.
OhmegaPly® is a nickel-phosphorous (NiP) metal alloy that is electrodeposited onto the matte, or tooth side, of copper foil. The thin film NiP metal alloy/copper foil combination is called OhmegaPly RCM® (Resistor Conductor Material). RCM is laminated to a dielectric material (like any other copper foil) and subtractively processed (Print and Etch) to produce copper circuitry and planar resistors. Because of its thin film nature, it can be embedded within layers without increasing the thickness of the board or occupying any board surface area as is required for discrete chip resistors.
Ordering and specifying OhmegaPly has never been easier!
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Ohmega Technologies, Inc. supports “The Global e-Sustainability Initiative”. OhmegaPly is a “green” technology in compliance with US environmental regulatory requirements and the EU Directives.